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STM32WBA50KG Datasheet(PDF) 105 Page - STMicroelectronics |
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STM32WBA50KG Datasheet(HTML) 105 Page - STMicroelectronics |
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105 / 110 page ![]() DS14688 Rev 1 105/110 STM32WBA50KG Package information 106 solder this back-side pad to PCB ground. Figure 28. UFQFPN32 - Recommended footprint 1. Dimensions are expressed in millimeters. Table 81. UFQFPN32 - Mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to four decimal digits. Min Typ Max Min Typ Max A 0.500 0.550 0.600 0.0197 0.0217 0.0236 A1 0.000 0.020 0.050 0.0000 0.0008 0.0020 A3 - 0.152 - - 0.0060 - b 0.180 - 0.300 0.0071 - 0.0118 D(2) 2. Dimensions D and E do not include mold protrusion, not to exceed 0,15 mm. 4.900 5.000 5.100 0.1929 0.1969 0.2008 D1 3.400 - 3.700 0.1339 - 0.1457 D2 3.400 - 3.600 0.1339 - 0.1417 E(2) 4.900 5.000 5.100 0.1929 0.1969 0.2008 E1 3.400 - 3.700 0.1339 - 0.1457 E2 3.400 - 3.700 0.1339 - 0.1457 e - 0.500 - - 0.0197 - L 0.300 0.400 0.500 0.0118 0.0157 0.0197 ddd - - 0.080 - - 0.0031 A0B8_FP_V2 5.30 3.80 0.60 3.45 0.50 3.45 3.80 0.75 3.80 0.30 5.30 16 17 9 8 1 25 32 24 |
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