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MFS2301BMBACEP Datasheet(PDF) 16 Page - NXP Semiconductors

Part # MFS2301BMBACEP
Description  Safety system basis chip (SBC) with power management, CAN FD and LIN transceivers
PDF  230 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

MFS2301BMBACEP Datasheet(HTML) 16 Page - NXP Semiconductors

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NXP Semiconductors
FS23
Safety system basis chip (SBC) with power management, CAN FD and LIN transceivers
9 Electrostatic discharge
All voltages referenced to ground, unless otherwise specified. Exceeding these ratings may cause a malfunction
or permanent damage to the device.
Symbol
Description (Rating)
Min
Max
Unit
ESD ratings
Human body model: AEC-Q100 Rev H.
VESD_HBM
All pins
–2
2
kV
VESD_GLOBAL_HBM Global pins (VSUP, VSHS, Vx_IN, V2_FB, LIMP0, FS0B, WAKEx, HVIOx, HSx)
–4
4
kV
VESD_CAN_HBM
CAN bus interface pins (CANH, CANL)
–8
8
kV
VESD_LIN_HBM
LIN bus interface pin (LIN)
–8
8
kV
Charged device model: AEC-Q100 Rev H
VESD_CDM
All pins
–500
500
V
Gun discharged contact Test
VESD_GUN1
330 Ω/150 pF unpowered according to IEC 61000-4-2
Global pins and bus interface pins
–8
8
kV
VESD_GUN2
2 kΩ/150 pF unpowered according to ISO 10605.2008
Global pins and bus interface pins
–8
8
kV
VESD_GUN3
2 kΩ/330 pF powered, GND connected, according to ISO 10605.2008
Global pins and bus interface pins
–8
8
kV
VESD_GUN4
330 Ω/150 pF unpowered, GND connected, according to ISO 10605.2008
Global pins and bus interface pins
–8
8
kV
Table 6. ESD ratings
FS23
All information provided in this document is subject to legal disclaimers.
© 2024 NXP B.V. All rights reserved.
Product data sheet
Rev. 7.0 — 16 October 2024
Document feedback
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