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BQ25713 Datasheet(PDF) 90 Page - Texas Instruments

Part # BQ25713
Description  BQ25730 I2C 1- to 5-Cell Buck-Boost Narrow VDC Battery Charge Controller with Power Path Control and USB-C PD 3.0 OTG Output
PDF  111 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

BQ25713 Datasheet(HTML) 90 Page - Texas Instruments

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CIN
CHG
I
= I
D × (1
D)
´
-
(4)
Low ESR ceramic capacitor such as X7R or X5R is preferred for input decoupling capacitor and should be
placed in front of RAC current sensing and as close as possible to the power stage half bridge MOSFETs.
Capacitance after RAC before power stage half bridge should be limited to 10 nF + 1 nF referring to Figure 9-3
diagram. Because too large capacitance after RAC could filter out RAC current sensing ripple information. Voltage
rating of the capacitor must be higher than normal input voltage level, 25-V rating or higher capacitor is preferred
for 19-V to 20-V input voltage.
Ceramic capacitors (MLCC) show a dc-bias effect. This effect reduces the effective capacitance when a dc-bias
voltage is applied across a ceramic capacitor, as on the input capacitor of a charger. The effect may lead
to a significant capacitance drop, especially for high input voltages and small capacitor packages. See the
manufacturer's data sheet about the derating performance with a dc bias voltage applied. It may be necessary
to choose a higher voltage rating or nominal capacitance value in order to get the required effective capacitance
value at the operating point.
9.2.2.5 Output Capacitor
Output capacitor also should have enough ripple current rating to absorb output switching ripple current. To
get good loop stability, the resonant frequency of the output inductor and output capacitor should be designed
between 10 kHz and 20 kHz. The preferred ceramic capacitor is 25-V X7R or X5R for output capacitor. Minimum
7 pcs of 10-μF 0603 package capacitor is suggested to be placed as close as possible to Q3&Q4 half bridge
(between Q4 drain and Q3 source terminal). Total minimum output effective capacitance along VSYS distribution
line is 50 μF refers to Table 9-1. Recommend to place minimum 20-μF MLCC capacitors after the charge current
sense resistor for best stability.
Ceramic capacitors show a dc-bias effect. This effect reduces the effective capacitance when a dc-bias
voltage is applied across a ceramic capacitor, as on the output capacitor of a charger. The effect may lead
to a significant capacitance drop, especially for high output voltages and small capacitor packages. See the
manufacturer's data sheet about the derating performance with a dc bias voltage applied. It may be necessary
to choose a higher voltage rating or nominal capacitance value in order to get the required capacitance value
at the operating point. Considering the 25-V 0603 package MLCC capacitance derating under 21-V to 23-V
output voltage, the recommended practical capacitors configuration at VSYS output terminal can also be found
in Table 9-1. Tantalum capacitors (POSCAP) can avoid dc-bias effect and temperature variation effect which are
recommend to be used along VSYS output distribution line to meet total minimum effective output capacitance
requirement.
Table 9-1. Minimum Output Capacitance Requirement
OUTPUT CAPACITORS vs TOTAL INPUT
POWER
65 W
90 W
130 W
Minimum Effective Output Capacitance
50 μF
50 μF
50 μF
Minimum output capacitors at charger VSYS
output terminal
7*10 μF (0603 25 V MLCC)
9*10 μF (0603 25 V MLCC)
9*10 μF (0603 25 V MLCC)
Additional output capacitors along VSYS
distribution line
2*22 μF (25 V~35 V
POSCAP)
2*22 μF (25 V~35 V
POSCAP)
2*22 μF (25 V~35 V
POSCAP)
9.2.2.6 Power MOSFETs Selection
Four external N-channel MOSFETs are used for a synchronous switching battery charger. The gate drivers are
integrated into the IC with 6 V of gate drive voltage. 30 V or higher voltage rating MOSFETs are preferred for
19-V to 20-V input voltage.
Figure-of-merit (FOM) is usually used for selecting proper MOSFET based on a tradeoff between the conduction
loss and switching loss. For the top side MOSFET, FOM is defined as the product of a MOSFET's on-resistance,
RDS(ON), and the gate-to-drain charge, QGD. For the bottom side MOSFET, FOM is defined as the product of the
MOSFET's on-resistance, RDS(ON), and the total gate charge, QG.
BQ25730
SLUSE65A – FEBRUARY 2021 – REVISED JANUARY 2024
www.ti.com
90
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Product Folder Links: BQ25730



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