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BQ25713 Datasheet(PDF) 108 Page - Texas Instruments |
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BQ25713 Datasheet(HTML) 108 Page - Texas Instruments |
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108 / 111 page  www.ti.com PACKAGE OUTLINE C 32X 0.25 0.15 2.8 0.05 32X 0.45 0.25 0.8 MAX (0.2) TYP 0.05 0.00 28X 0.4 2X 2.8 2X 2.8 A 4.1 3.9 B 4.1 3.9 0.25 0.15 0.45 0.25 4X (0.45) (0.1) WQFN - 0.8 mm max height RSN0032B PLASTIC QUAD FLATPACK - NO LEAD 4219109/B 08/2019 PIN 1 INDEX AREA 0.08 C SEATING PLANE 1 8 17 24 9 16 32 25 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 EXPOSED THERMAL PAD DETAIL SEE TERMINAL SYMM SYMM NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. 33 SEE SIDE WALL DETAIL SCALE 3.000 DETAIL OPTIONAL TERMINAL TYPICAL SIDE WALL DETAIL OPTIONAL METAL THICKNESS |
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